http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110885993-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2b5d4f45c6674ea7ea8dc882a1cfafa |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-32 |
| filingDate | 2018-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3053d067131bb9d0d5a6f5c48e67374 |
| publicationDate | 2020-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110885993-A |
| titleOfInvention | Neutral tin electroplating solution |
| abstract | The invention discloses neutral tin electroplating solution, which comprises the following substances in concentration: 25-60g/L of tin salt, 50-250g/L of conductive agent, 50-300g/L of complexing agent and 10-100mL/L of additive; the complexing agent is carboxylic acid or carboxylate; the additive consists of an aqueous solution of the following substances in concentration: 0.01-0.5g/L of polyoxypropylene ether and quaternary ammonium salt R 4 NX0.1-5g/L, R is C 1‑20 Alkyl radical, C 1‑20 Aryl or C 1‑20 And the X is halogen anion, sulfate anion or phosphate anion. The additive in the neutral tin electroplating solution can effectively inhibit sticking and coagulation phenomena, the sticking rate is lower than 1%, no bubble is generated in the electroplating process, and the defoaming performance of the electroplating solution is good; the synergistic effect among the components of the invention avoids Sn 2+ The transparency and the stability of the electroplating solution are improved. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112095127-A |
| priorityDate | 2018-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.