http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110885654-B

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
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filingDate 2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-110885654-B
titleOfInvention A reworkable one-component epoxy structural adhesive and its preparation method and application
abstract The invention discloses a reworkable one-component epoxy structural adhesive and a preparation method and application thereof. The structural adhesive is mainly made of the following raw materials by weight: 15.0-35.0 percent of bisphenol A or F epoxy resin, Polyurethane modified epoxy resin 15.0-35.0%, polythiol curing agent 25.0-35.0%, accelerator 2.0-4.0%, stabilizer 1.0-2.0%, thixotropic agent 4.0-6.0%, black pigment 1.0-3.0 %. The structural adhesive of the present invention is mainly applied to the bonding of micro-devices in small electronic products such as mobile phones, tablets, notebook computers and automotive display screens, and has the following characteristics: (1) repairable; (2) high bonding force; (3) ) Good toughness; (5) Fast curing at low temperature (can meet the curing conditions of 10min@80℃); (4) Long operating time. At the same time, the invention has simple production process and high efficiency, and can be applied in large-scale production.
priorityDate 2019-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 37.