| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0783
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0158
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4635
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0017
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-189
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-386 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 |
| filingDate |
2018-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110859029-B |
| titleOfInvention |
Flexible circuit board and manufacturing method thereof |
| abstract |
The invention provides a manufacturing method of a flexible circuit board, which comprises the following steps: providing a substrate; coating an adhesive solution on two opposite surfaces of the substrate in a coating mode and drying to form two adhesive layers, wherein the adhesive solution contains an adhesive and a solvent, and the viscosity of the adhesive solution is 5000 mPa.s; respectively forming a first copper layer and a second copper layer on the surface of each adhesion layer departing from the substrate; etching the first copper layer and the second copper layer to form a first signal line layer and a second signal line layer, respectively; and respectively coating insulating layers on the surfaces of the first signal circuit layer and the second signal circuit layer. The flexible circuit board prepared by the manufacturing method has low dielectric loss. In addition, the invention also provides a flexible circuit board. |
| priorityDate |
2018-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |