http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110842393-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3612 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-264 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-14 |
| filingDate | 2019-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110842393-B |
| titleOfInvention | Low-temperature lead-free soldering paste and preparation method thereof |
| abstract | The invention relates to the technical field of soldering paste, in particular to low-temperature lead-free soldering paste and a preparation method thereof. A low temperature lead-free solder paste comprising at least the following components: low-temperature welding powder, reactive substances, an activating agent, an initiator and a solvent; the low-temperature welding powder comprises, by mass, 0.5-3% of silver powder, 0.2-0.5% of copper powder, 0.1-0.4% of titanium powder, 0.1-1% of nickel powder, 0.1-0.5% of bismuth powder, and the balance of tin powder; the dosage of the reactive substance is 5-25% of the total mass of the low-temperature welding powder; the dosage of the activating agent is 1-5% of the total mass of the low-temperature welding powder. By adding a certain proportion of reactive substances into the low-temperature soldering powder, the reactive substances generate a polymer with a certain structure by polymerization in the later use and heating stage of the soldering paste, so that the soldering point is stabilized, and the mechanical strength of the soldering point is obviously enhanced. |
| priorityDate | 2019-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 100.