| abstract |
The present invention relates to thermally or vacuum formable flexible and stretchable ultraviolet curable and thermally curable dielectric ink compositions. Flexible inks form stretchable dielectric coatings with excellent adhesion. The dielectric ink composition can be applied to circuit boards, such as paper-phenolic resin boards, plastic boards (PMMA, PET, etc.) or glass-epoxy boards, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as capacitive touch, in-mold forming, forming crossovers on insulating layers, and manufacturing electronic circuits and devices. |