http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110820021-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25F3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C8-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C8-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate | 2019-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-01-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110820021-B |
| titleOfInvention | Anti-stripping copper foil for circuit board and preparation method thereof |
| abstract | The invention provides a copper foil for an anti-stripping circuit board and a preparation method thereof, and relates to the technical field of circuit board copper foil processing. The copper foil is obtained by firstly mixing a composite additive A to prepare a base copper foil, and then treating the surface of the base copper foil with a composite treating agent B, wherein the composite additive A is prepared from the following raw materials: polyethylene glycol, collagen, 2-mercaptobenzimidazole, thiourea and sodium tungstate; the compound treating agent B is prepared from the following raw materials: gamma-methacryloxypropyltrimethoxysilane, 3- (2, 3-glycidoxy) propyltrimethoxysilane, glycidyl methacrylate and N- (beta-aminoethyl) -gamma-aminopropyltrimethoxysilane. The invention overcomes the defects of the prior art, effectively ensures that the prepared copper foil has excellent tensile strength and ductility, effectively improves the peel strength of the copper foil, enhances the stability of the copper foil, improves the comprehensive performance of the copper foil, and is suitable for popularization and production. |
| priorityDate | 2019-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.