http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110783281-B
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-291 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
filingDate | 2019-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-110783281-B |
titleOfInvention | Film packaging assembly of stretchable electronic device and preparation method thereof |
abstract | The invention belongs to the field of electronic device packaging, and discloses a film packaging assembly of a stretchable electronic device and a preparation method thereof. The assembly comprises an electronic device to be packaged, a blocking layer, a photo-thermal conduction layer and a hydrophobic protection layer from bottom to top, wherein the hydrophobic protection layer is used for blocking external water vapor from directly contacting with the photo-thermal conduction layer and corroding the photo-thermal conduction layer, the photo-thermal conduction layer is used for enhancing the overall light transmission and heat dissipation capacity of the device, the blocking layer is used for further blocking water and oxygen in the air and preventing the water and the oxygen from entering the electronic device to be packaged, and the blocking layer comprises an organic coating and an inorganic-organic composite layer; the photothermal conductive layer sequentially comprises two packaging layers and a metal heat dissipation layer arranged between the two packaging layers. The application also correspondingly discloses a preparation method of the packaging assembly. The packaging assembly obtained by the invention has good water vapor barrier capability, gives consideration to good light transmittance, heat transfer property and tensile property, and can realize long-term protection of the stretchable electronic device. |
priorityDate | 2019-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.