http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110777406-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C14-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-18 |
| filingDate | 2019-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110777406-B |
| titleOfInvention | In-hole electroplating structure and manufacturing method thereof |
| abstract | The invention discloses an in-hole electroplating structure and a manufacturing method thereof, wherein the method comprises the following steps: covering a first photoresist layer on the semiconductor substrate, and exposing and developing at the hole to be manufactured; etching the semiconductor substrate by using the first photoresist layer as a mask to prepare a hole, wherein the bottom of the hole is a metal layer on the other surface of the semiconductor substrate, and removing the first photoresist layer; a seed layer metal is deposited. According to the scheme, after the hole with the seed crystal layer metal is manufactured on the semiconductor substrate, the dry film photoresist is adhered to the semiconductor substrate, the hole region is exposed and developed, the metal is electroplated to the hole region to form an electroplated metal layer, the dry film photoresist is removed, the abnormal condition of the film surface caused by large photoresist consumption after the photoresist fills the hole is avoided, and the electroplating effect is also prevented from being influenced due to the fact that the photoresist remains in the hole; meanwhile, the cost is saved, and the production efficiency is improved. |
| priorityDate | 2019-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557771 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14770 |
Total number of triples: 23.