http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110770276-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_67ddb426ec27b4566aa864c9a6ed9d1c |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-623 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2018-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1942fe3e3ab859c65d296ac40217cc8d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_177a9e551e9208e03a62eeb724d91dbe |
| publicationDate | 2020-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110770276-A |
| titleOfInvention | Composition, epoxy resin curing agent, epoxy resin composition, thermosetting composition, cured product, semiconductor device, and interlayer insulating material |
| abstract | Contains a maleimide compound (A) represented by the following general formula (1), an aminophenol compound (B) represented by the following general formula (2), and a phenol compound represented by the following general formula (3) The composition of (C) is suitable as a hardener for an epoxy resin composition that can satisfy high flame retardancy, high heat resistance, and low decomposition properties at high temperatures, and the composition has excellent storage stability. (In formula (1), Ar 1 is an arylene group having 6 to 12 carbon atoms which may be substituted, X 1 is a direct bond, a divalent hydrocarbon group having 1 to 6 carbon atoms, O, S or SO 2 , and p is Integer of 0 to 2) (in formula (2), Ar 2 is an arylene group of 6 to 12 carbon atoms that includes a hydroxyl group in the range of 0 to 2 and may have a hydrocarbon substituent, X 2 is a direct bond, A divalent hydrocarbon group having 1 to 6 carbon atoms, O, S or SO 2 , and q is an integer of 0 to 2) (in formula (3), Ar 3 is 2 to 4 based on the number of allyl groups in one molecule). Arylene group with 6 to 24 carbon atoms including allyl groups and 0 to 2 hydroxyl groups in the range of the range, X 3 is a direct bond, a divalent hydrocarbon group with 1 to 6 carbon atoms, O, S or SO 2 , r is an integer from 0 to 2) |
| priorityDate | 2017-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 110.