http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110769618-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 2019-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110769618-B |
| titleOfInvention | Method for plating copper in PCB hole |
| abstract | The invention relates to the technical field of PCB processing technology, in particular to a method for plating copper in a PCB hole, which comprises the following steps: (1) drilling: selecting a substrate according to design specifications and carrying out drilling treatment; (2) polishing; (3) carrying out sand blasting (4) and carrying out juvenile grinding; (5) removing glue; (6) copper deposition: placing the substrate inCarrying out copper deposition treatment in the copper deposition liquid medicine, wherein the copper deposition rate is 40-60U', and the Cu content of the copper deposition liquid medicine is Cu 2+ The concentration of NaOH, HCHO and EDTA is 1.7-2.3g/L, 6-10g/L, 1.9-4.6g/L and 27-43g/L in sequence; (7) drying; (8) VCP electroplating of copper. According to the invention, after the copper deposition rate and the concentration of the liquid medicine components of the copper deposition process are optimized, the abnormal problems of foaming, breakage and the like at the bottom of the hole are effectively solved, the effect is obvious, and the method is easy to industrialize. |
| priorityDate | 2019-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.