| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_14ba71eccbb5f65a22b78f39b3c6ffc3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-019
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00333
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-008 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate |
2019-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09290ed6b0605d0524cdaa37573cee05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_454f94435deb14bd8eaf4237d55b4ba6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54b88fae2e1b1871b2669d66426c5f53 |
| publicationDate |
2020-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110745775-A |
| titleOfInvention |
Process for manufacturing microelectromechanical devices, especially electroacoustic modules |
| abstract |
The present disclosure relates to processes for fabricating microelectromechanical devices, particularly electroacoustic modules. A process for fabricating a MEMS device includes forming a first component including: a dielectric region; a redistribution region; and a plurality of cell portions. Each cell portion of the first assembly includes: a die disposed in the dielectric region; and a plurality of first and second connection elements extending to opposite faces of the redistribution region and passing through a die extending in the redistribution region. The paths are connected together and the first connection element is coupled to the die. The process further includes: forming a second assembly including a plurality of respective cell portions, each respective cell portion of the plurality of respective cell portions including a semiconductor portion and a third connection element; mechanically coupling the first and second assemblies to connecting the third connection element to the corresponding second connection element; and then removing at least a portion of the semiconductor portion of each cell portion of the second assembly, thereby forming a corresponding film. |
| priorityDate |
2018-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |