| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06555
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53257
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| filingDate |
2019-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d2612fdd84c57110bc8aa5b9434a195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8981f77592468a3a140d523e02f630c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e26712067ff01ae3b3304039fd734806
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b60a01253fc1f6cec6080537146aa31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfb05df85915c45bfc0ada696e6b44aa |
| publicationDate |
2020-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110729277-A |
| titleOfInvention |
semiconductor structure |
| abstract |
Some embodiments of the present disclosure illustrate a semiconductor structure. The semiconductor structure includes a first wafer having first wires and first conductive islands formed on the first wires. The first wafer further includes a first plurality of through holes formed in the first conductive islands and electrically coupled to the first wires. The semiconductor structure also includes a second wafer bonded to the first wafer, wherein the second wafer includes second wires and second conductive islands formed on the second wires. The second wafer further includes a second plurality of through holes formed in the second conductive islands and electrically coupled to the second conductive lines. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11605620-B2 |
| priorityDate |
2018-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |