| abstract |
An object of the present invention is to provide an epoxy resin, a composition, and a cured product thereof which are excellent in the balance between the molding shrinkage rate at the time of heating and curing of the composition containing an epoxy resin, and the heat resistance of the cured product. Specifically, to provide an epoxy resin characterized by being a tetramethylbiphenol-type epoxy resin represented by the following structural formula (wherein, n represents a repeating number, and is an integer of 0 to 5), resin The content rate of the 1,2-diol in the invention is 0.065 to 0.10 meq/g, and the production method of the epoxy resin, an epoxy resin composition containing the same, a cured product thereof, and uses thereof are provided. |