| abstract |
The invention provides an inorganic filler prepared by a coating process, which has a core-shell structure, wherein the surface of conductive powder is coated with a ceramic coating to isolate the conductive powder, so that the dielectric loss caused by the conductive powder forming a conductive path in a polymer matrix is avoided, and the formed inorganic filler has high dielectric constant and low dielectric loss, and the ceramic coating cannot be damaged during compounding. The invention also provides a preparation method of the inorganic filler and an inorganic-organic composite dielectric material film containing the inorganic filler. |