http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110676205-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_203419448c7d6f110a93771f5b196459 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P80-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0392 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-09 |
| filingDate | 2019-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aaa2b85c7b8cedff82ad20bc218e3a30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9054da4b1d44075e3c6a5998eb2f250d |
| publicationDate | 2020-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110676205-A |
| titleOfInvention | Multiple use method of chip substrate and infrared detector |
| abstract | The invention provides a method for multiple use of a substrate of a chip and an infrared detector. The method for multiple use of the substrate of a chip includes: growing and preparing a thin film layer on the substrate; connecting part of the substrate with the thin film layer Separation to obtain the separated substrate residue; wherein, the substrate residue can be further prepared by at least one thin film layer growth. According to the multiple-use method of the chip substrate of the present invention, when the chip is prepared, after the part of the substrate is separated from the thin film layer, the remaining material of the substrate can still be processed for multiple times, so that the material of the substrate can be effectively reduced waste, reducing production costs. Moreover, the processing efficiency of the chip is effectively improved, and the convenience of the chip processing is improved. |
| priorityDate | 2019-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.