| abstract |
The present invention provides a compound, a method for producing the compound, and an organic film-forming composition using the compound, which can be formed and cured not only in air but also under film-forming conditions in an inert gas without generating by-products, An organic underlayer film that is excellent in heat resistance and embedding or planarization properties of patterns formed on a substrate, and also has good dry etching resistance during substrate processing. The compound has two or more structures represented by the following general formula (1-1) in the molecule. In the formula, Ar represents an aromatic ring that may have a substituent or an aromatic ring containing more than one nitrogen atom and sulfur atom, and two Ars can be connected to each other to form a ring structure; the dashed line is the bond with Y, and Y is a A divalent or trivalent organic group with 6 to 30 carbon atoms in an aromatic ring or heteroaromatic ring that may have substituents and whose bond is located in the aromatic ring structure or heteroaromatic ring structure; R is a hydrogen atom or a carbon atom A monovalent group whose number is 1 to 68. |