http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110591000-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0812 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F232-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F230-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F232-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 |
| filingDate | 2019-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-04-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110591000-B |
| titleOfInvention | High-temperature-resistant die material of poly-dicyclopentadienyl and preparation method thereof |
| abstract | A high-temperature resistant die material of polydicyclopentadienyl and a preparation method thereof comprise a liquid A raw material and a liquid B raw material. The liquid A raw material components comprise, by weight, 25-85 parts of heat-conducting filler, 0.5-3 parts of surface modifier, and raw material DCPD: 15-74 parts; the raw material components of the liquid B comprise 40-400ppm Grubbs catalyst, 0.2-1.0 part of defoaming agent and 0.15-0.5 part of flatting agent according to parts by weight of DCPD monomer concentration in the liquid A. The invention adopts polydicyclopentadiene as the base material of the resin mould, the viscosity of the DCPD resin is low, so that sand holes and cavities caused by air bubbles in a system can be easily eliminated, the defects of difficult air bubble discharge and sand holes and cavities are eliminated, the heat-resistant temperature and the dimensional stability of the resin mould are improved, the service life of the resin mould under the high-temperature condition is prolonged, the forming period of the resin mould is shortened, and the development period and the cost of the mould are reduced. |
| priorityDate | 2019-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.