http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110572944-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_564a63ee14a6e4ac692268ee966a93e6 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
filingDate | 2019-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3f2116cfded06d65d4f36213d5e43f1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4f091abcfefecf0ea8c92ab9d2dd562 |
publicationDate | 2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-110572944-A |
titleOfInvention | Method and device for manufacturing exposed area of rigid-flex board |
abstract | The invention discloses a method and device for manufacturing an exposed area of a rigid-flexible combined board. The method includes: setting a groove at a designated position of a rigid board based on a laser, and the surface where the groove is located is the groove surface; pressing the groove surface and the flexible board together Obtain the original rigid-flexible plate; remove the rigid plate from the non-grooved surface to obtain a separation groove with a specified depth and specified width to connect the groove, and divide the rigid plate to obtain the exposed area. Means are used to perform the method. In the embodiment of the present invention, a groove is set at a specified position of the rigid plate based on laser; the original rigid-flexible plate is obtained by pressing the surface of the groove and the flexible plate; the rigid plate is removed to obtain a separation groove with a specified depth and a specified width to connect the groove, Divide the rigid board to obtain the exposed area; laser ablation can minimize the strength imbalance of the rigid board caused by pre-grooving, and prevent the flexible board from being accidentally damaged by excessive cutting through the pre-set groove. |
priorityDate | 2019-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Predicate | Subject |
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isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 |
Total number of triples: 17.