http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110572932-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6844109cf538d7aeffc3853527b5aa76 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G65-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G65-48 |
| filingDate | 2018-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12d735ce21cadda60b3f91674d0002c7 |
| publicationDate | 2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110572932-A |
| titleOfInvention | Interlayer insulating material for multilayer printed circuit board and its manufacturing process |
| abstract | The invention discloses an interlayer insulating material for a multi-layer printed circuit board and a manufacturing process thereof. The aniline diphenyl ether oligomer containing active end groups is prepared by reacting with acetanilide by using methoxy diphenyl ether as a raw material. It is copolymerized with epoxy resin, no small molecules are released during the copolymerization, and the cured product maintains the advantages of polydiphenyl ether resin. The thermal decomposition temperature of the copolymer reaches 365.25 ° C, and the temperature index is 187.14 ° C. It can be used as a high temperature resistant insulating material. in the field of electrical machinery. |
| priorityDate | 2018-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.