http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110549040-B
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-24 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22 |
filingDate | 2019-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2021-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2021-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-110549040-B |
titleOfInvention | Aluminum nitride/nano-silver solder paste heat conduction material and preparation method thereof |
abstract | The invention discloses an aluminum nitride/nano silver soldering paste heat conduction material and a preparation method thereof, nano aluminum nitride with silver plated on the surface is taken as a reinforcing phase and doped in nano silver soldering paste to prepare the heat conduction material, and the steps are as follows: firstly, preprocessing nano aluminum nitride powder, then plating silver on the surface of the nano aluminum nitride in a chemical silver plating mode, and finally adding the modified nano aluminum nitride particles into nano silver slurry for mixing. The invention overcomes the poor wettability of the metal silver and the aluminum nitride surface, the preparation process is simple, and the obtained aluminum nitride/nano silver soldering paste has high thermal conductivity and low sintering temperature. |
priorityDate | 2019-09-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 51.