http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110511527-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_58e5ecf8e70622533987d3d61e983540 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-54 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-1345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-134 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L55-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-10 |
| filingDate | 2019-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1e0ae4e43a6bdd5df3517c143c3281e |
| publicationDate | 2019-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110511527-A |
| titleOfInvention | A kind of preparation method of heat-resistant high-binding ABS resin material |
| abstract | The invention relates to a preparation method of a heat-resistant high-bond ABS resin material, and belongs to the technical field of resin materials. The technical scheme of the present invention adopts ionic liquid for auxiliary modification. As ionic liquid is a green solvent, compared with other modifiers, ionic liquid has lower surface tension and will not affect the stability of natural latex. The ionic liquid of carbon nanotubes is modified by non-covalent bonds, and the modified whisker material itself acts as a reinforcing filler to form a filler network in the rubber matrix, which increases the bonding and crosslinking density of the composite material, and at the same time has excellent dispersion. It can effectively load the material into the interior of the material, form effective and good thermal conductivity and heat resistance, and can quickly dissipate heat, which effectively solves the problem of low heat resistance and poor bonding strength. |
| priorityDate | 2019-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.