http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110494524-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-22 |
filingDate | 2018-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dedf26174d0708e12a0ee501d9c2beb8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_85f62016bb7cc2511160bdfb971b4b63 |
publicationDate | 2019-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-110494524-A |
titleOfInvention | adhesive sheet |
abstract | The present invention provides a pressure-sensitive adhesive sheet comprising a heat-expandable base material and a pressure-sensitive adhesive layer, wherein the heat-expandable base material contains a resin and heat-expandable particles having an expansion initiation temperature (t) of 120 to 250° C., and is non- Adhesion, the pressure-sensitive adhesive layer contains an adhesive resin, and the thermally expandable base material satisfies the following requirements (1) to (2). Requirement (1): At 23° C., the storage modulus E′ (23) of the thermally expandable substrate is 1.0×10 6 Pa or more; Requirement (2): At the expansion initiation temperature of the thermally expandable particles In (t), the storage elastic modulus E'(t) of the thermally expandable base material is 1.0×10 7 Pa or less. |
priorityDate | 2017-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 177.