http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110438550-B

Outgoing Links

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filingDate 2019-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-110438550-B
titleOfInvention Preparation method of ultra-sharp diamond wire saw and diamond wire saw
abstract The invention discloses a preparation method of an ultra-sharp diamond wire saw and the diamond wire saw. The surface treatment of the diamond comprises the substeps of high-temperature sintering, deplating reaction, purification, acid washing, electrification and the like, so that the surface of the diamond becomes rough, the edges and corners of the diamond are increased, and the holding force of the diamond on a steel wire is improved; and the surface of the diamond is not plated with nickel any more, but is processed into diamond bare powder by a chemical method, so that the diamond bare powder is easy to deposit on a steel wire matrix, and sanding of the bare powder is realized. Therefore, the diamond wire saw does not have the phenomenon of diamond powder agglomeration, has thinner wire diameter and more stable performance, and can reduce the loss of cut raw materials; because the diamond is not wrapped by nickel metal, the problem that the nickel metal is abraded and stuck on the surface of the diamond wire does not exist during cutting, and the cutting force is more durable.
priorityDate 2019-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 36.