| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2018-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2451672b1d0ad2577c477c21b6f24af
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4057909ad78acbdfd509d7d12836dfe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20458c8c18df959db2209b8df1f3ad0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfad1fdfef6126bcbec463e5b8ae370c |
| publicationDate |
2019-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110431209-A |
| titleOfInvention |
Polishing composition, its production method, polishing method using the same, and substrate production method |
| abstract |
The present invention provides a polishing composition capable of reducing unintentional height differences between different materials and unintentional height differences between dense and dense portions of a pattern. The present invention relates to a polishing composition comprising: abrasive grains having an average primary particle diameter of 5 to 50 nm, and improvement in height difference of a compound containing an aromatic ring having a specific structure and a sulfo group directly bonded thereto or a salt group thereof agent and dispersion medium, the pH of the polishing composition is less than 7. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114426809-A |
| priorityDate |
2017-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |