http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110416415-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8eaf0e75177d288022d3cbabcc3ceada |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-549 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K50-8426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K30-88 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-44 |
| filingDate | 2019-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_adaf03dff0a13bc03dd41030470c3503 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_90bbcbffe91734b22b376bf1ee7cfe3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f39223f4d900a9aba62210026374f00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4e49328c4833ff6b42381bf8b2bd762 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32ccee39a207795a5d19106c2a420028 |
| publicationDate | 2019-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110416415-A |
| titleOfInvention | A kind of optoelectronic device packaging method |
| abstract | The invention discloses a method for encapsulating an optoelectronic device, comprising the following steps: encapsulating the bottom end of the optoelectronic device module with a lower glass substrate, and then coating and sealing the edge of the optoelectronic device module in contact with the lower glass substrate with an ultraviolet curing resin; The top of the optoelectronic device module is encapsulated by using a thermally cross-linked resin mixture; the thermally-crosslinked resin mixture is prepared from epoxy resin, octylamine and m-xylylenediamine in a molar ratio of 4:2-3:1-2 The photoelectric device module is encapsulated by covering the upper end of the thermally cross-linked resin with a glass substrate. The packaging method of the invention protects optoelectronic devices, adapts to extremely complex and diverse external environments, improves the ability of the packaging film to resist breakage and scratches, and at the same time has the ability to heal itself in the case of scratches and damages and under certain temperature conditions, preventing the device from being damaged. damage and performance degradation. |
| priorityDate | 2019-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.