| abstract |
An object of the present invention is to provide a resin composition capable of obtaining a cured product having excellent smear removal properties and excellent adhesion with a conductor layer; a resin sheet containing the resin composition; printed wiring boards of insulating layers; and semiconductor devices. The solution of the present invention is a resin composition containing (A) an epoxy resin, (B) a benzoxazine-based curing agent, and (C) a (meth)acrylate, wherein, When the value obtained by dividing the mass of the component (B) by the benzoxazine ring equivalent is set to b, and the value obtained by dividing the mass of the component (C) by the (meth)acryloyl equivalent is set to c, b /c is 0.08 or more and 2.5 or less. |