http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110370098-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d40285e27f4ed83b8728b0d477404958 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B41-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B47-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B41-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B47-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B57-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-04 |
| filingDate | 2019-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e157539151c4dfe6c9f088f1168ecf37 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bcd4e7df772f4cf04d8044c58d360f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fda1888aa804daca1eb98d742e45ab10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc4a8ff7c69442c0decac01a48d214a0 |
| publicationDate | 2019-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110370098-A |
| titleOfInvention | Embedded ball mold compound abrasive particle grinding and polishing silicon micro-concave mold array method |
| abstract | The invention discloses a method for grinding and polishing silicon micro-concave mold arrays with embedded spherical mold compound abrasive particles. , the diameter of a single die is equal to the diameter of the sphere; half of the sphere is embedded in the hole, and there is a uniform layer of waterproof adhesive between each hole and the sphere; the polishing liquid is filled between the polishing mold and the surface of the workpiece, and the polishing liquid is The abrasive particles in the middle are composite abrasive particles. The grinding and polishing die makes high-frequency micro ultrasonic vibration on the upper surface of the workpiece. The ultrasonic vibration stimulates the half sphere exposed outside the tool head to continuously impact the surface of the workpiece with the abrasive particles, forming a shape that matches the size of the sphere. of microhemispherical pits. The invention uses the vibration of the micro-ultrasonic grinding and polishing mold to excite the high-frequency impact of the nano-scale abrasive particles in the sphere and the grinding and polishing liquid on the surface of the silicon workpiece, so as to realize the removal of the material. The processing efficiency of the micro-hemisphere concave die array is greatly improved, and the shape consistency of the concave die is ensured. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112975595-A |
| priorityDate | 2019-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 36.