http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110364498-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0a51fc1b2681d06a539d256c466aece8 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4803 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-467 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-427 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-467 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-427 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 |
| filingDate | 2019-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0e10f8f2e538a8acfd2e1b7ed861f35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44a5b7e49b2f37fef7f096c1ab79b936 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1fa55196ad2e8d91ec0d67fd1b0ff99b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30960372b101c74aae8739af6e70f7d8 |
| publicationDate | 2019-10-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110364498-A |
| titleOfInvention | A kind of porous flat plate formula radiator, system and manufacturing method |
| abstract | Include radiator body the invention discloses a kind of porous flat plate formula radiator, system and manufacturing method of heat radiator, the radiator, a cavity is formed with inside the radiator body, is formed with porous structure in the bottom interior wall of the cavity；It is provided with heat-pipe working medium in the cavity；The bottom outer surface of the cavity is ground to plane, using as heat transfer contact plane.It crosses and is formed with porous structure on the opposite cavity bottom inner wall of heat transfer contact plane, so as to effectively and quickly realize heat transfer, it is fast and efficiently conducted with heat caused by the heater element (such as CPU) that is touched heat transfer contact plane, core of the porous structure as vaporization, can effectively improve heat transfer efficiency；Simultaneously as heat transfer contact plane is the plane that a grinding is formed, and heater element contact position flatness height, thermal contact resistance can be reduced, and then heat transfer efficiency can be further improved. |
| priorityDate | 2019-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 32.