| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_68ef0a78973e9d759d25454a8ae3a419 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14 |
| filingDate |
2019-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80adb7e4c11dcae3094319a603e9b8d9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb9635f4311a698257218bbb61e01487 |
| publicationDate |
2019-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110343389-A |
| titleOfInvention |
Anisotropic insulating and heat-conducting composition and preparation method thereof |
| abstract |
The invention discloses an anisotropic insulating and heat-conducting composition and a preparation method thereof. The anisotropic insulating and heat-conducting composition includes raw materials and their mass parts as follows: 50-95 parts of vinyl-containing high-molecular-weight polysiloxane; Vinyl low molecular weight polysiloxane 5‑50 parts; non-reactive low molecular weight polysiloxane 5‑50 parts; flake thermally conductive filler 100‑400 parts; insulating thermally conductive filler 50‑400 parts; nanometer reinforcing filler 5 ‑20 parts; heat-resistant additive 1‑10 parts; and curing agent 0.05‑15 parts. The anisotropic insulating and heat-conducting composition of the present invention is used for heat dissipation of electronic components such as high-power chips. The thermal conductivity is improved by directional sheet-shaped heat-conducting fillers, and the physical properties of the cured product are improved by adding nano-reinforcing fillers. The obtained The thermal conductivity of the thermally conductive composition is greater than 9W/(m·K), the tensile strength is greater than 0.2MPa, and the elongation at break is greater than 80%; the anisotropic insulating heat conduction of the present invention is obtained by an extrusion lamination process, and the operation is simple. Conducive to large-scale continuous production. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113829406-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110791102-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114106566-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115304923-A |
| priorityDate |
2019-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |