http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110340747-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d40285e27f4ed83b8728b0d477404958
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B1-04
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-04
filingDate 2019-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bcd4e7df772f4cf04d8044c58d360f9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fda1888aa804daca1eb98d742e45ab10
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publicationDate 2019-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-110340747-A
titleOfInvention Bubble-controlled micro-ultrasonic sphere emission profiling array grinding and polishing method and device
abstract The invention discloses a method and a device for the grinding and polishing of a micro-ultrasonic sphere emission profiling array by controlling the bubbles. The vibration of a micro-ultrasonic grinding and polishing mold excites the high-frequency impact of the nano-scale abrasive particles in the sphere and the grinding and polishing liquid on the surface of the silicon carbide workpiece to be processed. , to achieve material removal. The invention greatly improves the processing efficiency of the micro-hemispherical concave die array, and ensures the shape consistency of the concave die by adjusting the air bubbles.
priorityDate 2019-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 24.