http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110297396-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_34c067d1bbfe85ac23d961d454a35d0e |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
filingDate | 2019-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4a95c9764f8c62a41b7bad303902754 |
publicationDate | 2019-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-110297396-A |
titleOfInvention | Curable resin composition for ink-jet |
abstract | The object of the present invention is to provide a kind of curable resin composition for ink-jet, the composition will not damage the coating as curable resin composition for ink-jet, and the oxidation of the conductors such as copper foil is prevented, the excellent solidfied material of chemical resistance, heat resistance, hardness of film can be obtained.The curable resin composition for ink-jet includes that (A) weight average molecular weight is that 500 or more (methyl) acrylate compounds of (methyl) acrylate compounds, (B) weight average molecular weight less than 500, (C) Photoepolymerizationinitiater initiater and (D) have the compound of primary amino group and imino group, and viscosity of the above-mentioned hardening resin composition at 25 DEG C is 200mPas or less. |
priorityDate | 2018-03-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 115.