| abstract |
The present invention provides a dielectric heating adhesive film for bonding a plurality of adherends formed of the same material or different materials by dielectric heating treatment, wherein the dielectric heating adhesive film contains a component A of Thermoplastic resin and a dielectric filler as component B, the component A comprising one or more resins selected from olefin-vinyl acetate copolymers and maleic anhydride-modified polyolefins, the olefin-vinyl acetate copolymers It contains 2 mass % or more of structural units derived from vinyl acetate. |