http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110289120-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate | 2019-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110289120-B |
| titleOfInvention | Preparation and packaging method of composite sintered silver preformed sheet |
| abstract | The invention provides a preparation and packaging method of a composite sintered silver preformed sheet, which comprises the following steps: mixing nano silver particles, micron silver particles, a sintering aid and an organic carrier according to a certain proportion to obtain a composite silver paste, wherein the composite silver paste comprises the following components in percentage by mass: 5-20% of nano silver particles, 40-70% of mixed micron silver particles, 1-10% of sintering aid, 0.1-1% of flatting agent, 0.1-2% of defoaming agent and 10-50% of mixed organic solvent, wherein the sum of the components is 100%; the film forming method is spin coating, casting or heating and drying after silk screen printing; the packaging method is to use a hot press or dynamic embedded hot pressing sintering equipment to interconnect the packaging structures. The composite sintered silver preformed sheet and the packaging scheme can be suitable for packaging large-area power chips, can solve the problems of long time, narrow process window and the like of the conventional pressureless and pressurized sintering process, and have the advantages of high temperature resistance, cold and thermal shock resistance and excellent service stability of interconnection welding spots. |
| priorityDate | 2019-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.