http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110282908-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59b855cf7eb66a77ddacdfecb7f3ba13 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2111-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2111-00844 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B26-14 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B111-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B26-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2019-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44924cb331e08e93ad407e7278b06d3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55393fe9f7486be48f3888c7c833a5b4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4366cb20f1091f0b977bc6570fe02ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_88747c72693ab6fd351a2227f63f3f05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55b878cb9bc62b357cdde1a24222c6ff |
| publicationDate | 2019-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110282908-A |
| titleOfInvention | A third-generation wide-bandgap semiconductor device packaging epoxy molding compound |
| abstract | The invention relates to an epoxy molding compound for packaging a third-generation wide bandgap semiconductor device. The epoxy molding compound contains epoxy resin, curing agent, modified curing accelerator, release agent, coupling agent, flame retardant, inorganic ore filler and the like. The epoxy molding compound produced by the present invention not only has the characteristics of good fluidity and flame retardancy, but also the modified curing accelerator can effectively improve the storage stability of the molding compound at normal temperature and the degree of reaction during curing, and improve the durability of the product. It has high temperature resistance and reduces the curing degree of the molding compound in the mold, thereby reducing the change in volume resistivity during material molding and reducing the risk of electrostatic failure. It can be applied to the packaging of third-generation wide bandgap semiconductor devices. |
| priorityDate | 2019-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.