| abstract |
The present invention relates to a kind of highly sensitive electronic skins and preparation method thereof, include: the first flexible substrate: the first encapsulated layer is wrapped up in outer surface, inner surface is the first substrate with regular shape or irregular shape, the surface of first substrate is coated with the first conductive layer, second flexible substrate: the second encapsulated layer is wrapped up in outer surface, inner surface is the second substrate with irregular shape, the surface of second substrate is coated with the second conductive layer, second substrate is oppositely arranged with the first substrate, and the inner surface of the first flexible substrate and the second flexible substrate is equipped with electrode.Compared with prior art, the preparation-obtained device sensitivity of the present invention is high, the linearity is wide, and used preparation process is simple, at low cost, has the prospect of batch production. |