http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110229639-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-102 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-1006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J135-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J193-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J135-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F222-14 |
| filingDate | 2019-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110229639-B |
| titleOfInvention | Composite glue for electronic surface sheet |
| abstract | The invention discloses composite glue for an electronic surface sheet, which is prepared from the following raw materials in parts by weight: 40-50 parts of methoxyethyl acrylate-acrylic acid-butyl acrylate copolymer solution, 40-50 parts of octanediol diacrylate-acrylic acid-butyl acrylate copolymer solution, 15-25 parts of liquid rosin resin and 5-10 parts of polymethylhydroxydienylsiloxane; the methoxy ethyl methacrylate-acrylic acid-butyl acrylate copolymer solution is prepared from the following raw materials in parts by weight: 40-45 parts of methoxyethyl methacrylate, 20-25 parts of acrylic acid, 30-35 parts of butyl acrylate, 70-95 parts of a solvent, 1.6-2.3 parts of azobisisobutyronitrile and 0.7-0.85 part of dodecyl mercaptan. The composite glue for the electronic surface sheet has small stripping force, is convenient to remove after the electronic surface sheet is pasted, and is suitable for the pasting requirement of the electronic surface sheet; after the electronic surface is adhered with glue alone, the electronic surface is removed, and the residual glue left on the surface of the adhered object is very small. |
| priorityDate | 2019-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.