http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110229515-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K13-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L51-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-053 |
| filingDate | 2019-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110229515-B |
| titleOfInvention | High-heat-resistance polyamide composition and preparation method thereof |
| abstract | The invention discloses a high heat-resistant polyamide composition and a preparation method thereof, wherein the composition comprises 25.0-98.0 wt% of polyamide, 0.5-15.0 wt% of epoxy resin, 0.01-3.0 wt% of stabilizer, 0.01-60.0 wt% of reinforcing agent, or 0.01-5.0 wt% of functional additive, the sum of the mass percentage contents is 100 wt%, the polyamide is semi-crystalline polyamide with a melting point of not less than 200 ℃, and the epoxy equivalent of the epoxy resin is 100-2500 g/eq. The invention selects the polyamide base materials with high-end amino and low-end carboxyl to reduce the generation of free radicals, simultaneously utilizes the high-temperature aging resistance of the epoxy resin to prevent the polyamide resin from being corroded by oxygen to generate thermo-oxidative aging, and improves the compatibility of the polyamide and the reinforcing agent through the strong polarity of the epoxy group, thereby overcoming the problems of insufficient high-temperature thermal aging performance and mechanical performance of the existing polyamide molding composition. |
| priorityDate | 2019-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 211.