http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110213905-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110213905-B |
| titleOfInvention | Packaging method of assembled circuit board, assembled circuit board and terminal |
| abstract | The invention provides a packaging method of an assembled circuit board, the assembled circuit board and a terminal, and relates to the technical field of communication. The method comprises the following steps: forming an isolation layer on a device mounting surface of the assembled circuit board; forming a support layer on the device mounting surface on which the isolation layer is formed; wherein the melting point of the isolation layer is lower than that of solder used for mounting the device on the device mounting surface. The scheme of the invention is used for solving the problems that the existing packaged PCBA cannot be maintained and the production cost is increased. |
| priorityDate | 2019-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 16.