| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2083-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0013 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3672
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C39-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C51-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-153
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K83-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-10 |
| filingDate |
2017-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110198820-B |
| titleOfInvention |
Three-dimensionally shaped thermally conductive molded body and method for producing same |
| abstract |
The present invention provides a three-dimensionally shaped heat conductive molded body that can ensure sufficient gap filling characteristics and contact surface area with respect to heat dissipating devices such as heat sinks and the like and heat generating devices such as IC chips and the like without increasing excessive stress of these devices, and a method for manufacturing the same. The three-dimensionally shaped, heat-conductive molded body of the first aspect of the present disclosure contains a heat-conductive material and a silicone-based material, the molded body has a substantially flat bottom surface, and a three-dimensionally shaped member is located on an inner side of the bottom surface, and the height of the three-dimensionally shaped member above the bottom surface differs in at least two positions. |
| priorityDate |
2016-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |