http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110128581-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2325-14 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q1-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F212-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F220-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01Q1-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F212-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-00 |
| filingDate | 2019-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110128581-B |
| titleOfInvention | Encapsulation process of microstrip patch antenna |
| abstract | The invention discloses a potting process of a microstrip patch of a millimeter wave response antenna, and belongs to the field of response antenna packaging. The method comprises the following steps: a, preparing fluorine-containing polystyrene microspheres by taking styrene and fluorine-containing monomers as raw materials and adopting a dispersion polymerization method; b, continuously foaming the fluorine-containing polystyrene microspheres obtained in the step A to obtain primary foaming fluorine-containing polystyrene microspheres; and C, placing the micro-strip patch into a mold, placing the primary foaming fluorine-containing polystyrene microspheres into a gap between the micro-strip patch and the mold, and locking the mold for encapsulation. The invention adopts fluorine-containing polystyrene as the encapsulating material, thereby not only solving the problem of adhesion of the foaming material to the microstrip patch, but also solving the problems of high insertion loss, low transmittance and other electrical properties of the encapsulating medium of the microstrip patch of the millimeter wave antenna due to the advantages of low dielectric constant, low dielectric loss, good foaming uniformity and the like. |
| priorityDate | 2019-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.