| abstract |
In order to provide a resin composition for printed wiring boards that does not have a clear glass transition temperature (no Tg) and can sufficiently reduce the warpage of printed wiring boards, especially multilayer coreless substrates (achieve low warpage), Dip material, resin sheet, laminate, metal foil-clad laminate, printed circuit board, and multilayer printed circuit board, the resin composition of the present invention contains an allylphenol compound (A), a maleimide compound (B) ), and the cyanate compound (C) and/or the epoxy compound (D). In addition, the content of the allylphenol compound (A) is 10 to 50 parts by mass relative to 100 parts by mass of resin solids in the resin composition for printed wiring boards, based on the resin solids in the resin composition for printed wiring boards. Content of a maleimide compound (B) is 40-80 mass parts with respect to 100 mass parts of components. |