abstract |
Embodiments of the present invention provide an integrated circuit package and a method of forming the same. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. A dummy die is attached to the first substrate and is adjacent to the integrated circuit die. An encapsulant is formed over the first substrate and around the dummy die and the integrated circuit die. The encapsulant, the dummy die, and the integrated circuit die are planarized with the uppermost surface of the encapsulant substantially flush with the uppermost surface of the dummy die and the uppermost surface of the integrated circuit die. The inner portion of the dummy die is removed. The remainder of the dummy die forms a ring structure. |