http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110108755-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e0eec63ebec71857cc99e9d98c68ca96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_561500f9809598b93fcc0720ac90d068 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L1-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N3-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L1-24 |
filingDate | 2019-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb8380e2cef1dbeddbec420f5f04d069 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a773e86d9c2c54335c89763512480de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5117038890b5670449b04802136fedec |
publicationDate | 2019-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | CN-110108755-A |
titleOfInvention | Superconducting tape pressurizes experiment mould under a kind of liquid environment |
abstract | The invention discloses the pressurization experiment moulds under a kind of superconducting tape liquid environment, design the electrical characteristics test of superconducting tape.The device includes pedestal, pressure conduction component and pressure measurement platform.The patent of pedestal belongs to superconductive current limiter field, is related to superconductive current limiter material of main part superconducting tape.Experiment mould includes: pedestal, pressure measurement platform, pressure conduction component.It by this experiment mould, can pressurize under liquid nitrogen environment to superconducting tape indirectly, and band pressure can be measured by corresponding means.Apply and measure pressure using the mold, there is no limitations to the extraneous process for applying pressure, therefore can adjust at any time ambient pressure by measurement result. |
priorityDate | 2019-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.