http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110104606-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4ce77f9c79258e3cd528f7a160d3b2b2
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-02
filingDate 2019-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c18aee6471b498029bb123888024712a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7c43411faddb4e282a39b88c0f876f0
publicationDate 2019-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-110104606-A
titleOfInvention A package structure of a MEMS infrared sensor
abstract The invention discloses a package structure of a MEMS infrared sensor, comprising: a bottom wafer with a placement groove for placing a MEMS infrared sensor chip in the middle and two vertical through-silicon holes on both sides; Two pads at both ends of the through hole; two connecting wires respectively connecting the two ends of the MEMS infrared sensor chip and the pad at the top of the through silicon hole; solder deposited on the top edge of the bottom wafer; soldered by solder An upper wafer of a sealed cavity is formed on top of the bottom wafer and between the bottom wafer and the bottom wafer. The present invention solves the above-mentioned problems of high packaging cost, slow efficiency and flat packaging.
priorityDate 2019-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123

Total number of triples: 21.