| abstract |
The invention discloses a flexible polyimide substrate used for micro-LED devices and a preparation method thereof. The substrate is composed of roughened copper pillars and modified polyimide. The preparation method of the invention comprises the following steps: preparation of copper pillar pattern, forming and roughening of copper pillar, modification and curing of polyimide, and the like. The substrate of the present invention uses polyimide as the main body, utilizes its flexibility to resist the impact of external stress, can improve the mechanical properties of chips and devices, and avoid the problem of chip cracking; the preparation method proposed by the present invention uses copper pillars to roughen , increase the surface roughness of the copper pillars, use the characteristics of strong fluidity of polyimide before curing, improve the bonding strength between the copper electrode and the main material of the substrate, so as to avoid the problem that the electrode falls off from the substrate. |