| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_447017a95b31009750124aae2395b205 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-08135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80896
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-80895
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-743
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4875
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-82
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-31 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| filingDate |
2017-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00ea5e4d8853886ae93472ccc9296c08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec9f314c0117fb40f8d60de63d44432c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c7f13376df22e0bbb0751a6c8e5706e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_971d2848bc5498185e84a87335c60422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f8435406bf186c9a1d6879f5f5bd95c0 |
| publicationDate |
2019-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-110088897-A |
| titleOfInvention |
Direct bonding of native interconnects and active base die |
| abstract |
The present invention provides directly bonded native interconnects and active base dies. In a microelectronic architecture, an active die or chiplet is connected to an active base die via its core-level conductors. These native interconnects provide short data paths, which forgo the overhead of standard interfaces. Since the native interconnects are coupled to bits, the system preserves redistribution routing. The base die may contain custom logic that allows the attached die to provide storage functions. The architecture can connect different interconnect types and chiplets from various process nodes operating at different voltages. The base die may have state elements for driving. The functional blocks on the base die receive native signals from different chiplets and communicate with all attached chiplets. The chiplets may share processing resources and memory resources of the base die. Routing blocking is minimal, resulting in improved signal quality and timing. The system is capable of operating at double data rate or quadruple data rate. The described architecture facilitates ASIC, ASSP and FPGA ICs as well as neural networks, reducing footprint and power requirements. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115053340-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11735526-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115053340-B |
| priorityDate |
2016-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |