| abstract |
The application discloses heat-conducting resin composition introduces the mesogen to the curing agent, utilizes the rigidity platykurtic structure of mesogen, still remains regular orderly liquid crystal phase after making epoxy solidify, and a large amount of regular orderly liquid crystal phase can improve heat conductivity of heat-conducting resin composition in the system, and the electronic packaging material that adopts this application heat-conducting resin composition to prepare has good thermal conductivity, and then satisfies the requirement of electron trade to the heat dissipation base plate thermal diffusivity. In addition, the preparation process of the heat-conducting resin composition is simple, the production is convenient, and the wide popularization and use are easy. |