| abstract |
A method for coating an interconnect for a solid oxide cell (SOC) stack, comprising providing an interconnect substrate comprising Cr and Fe, coating the interconnect substrate with a first metal layer by electrodeposition, and electrodepositing the resulting structure The second metallic cobalt layer is coated and the resulting structure is coated with a metallic copper layer by ion exchange plating. In this way, a metallic copper-cobalt coating is formed on the interconnect. |