| abstract |
The present invention provides a thermally conductive silicone composition containing the following components (A), (B), (C) and (D). Wherein, component (A) is composed of the following average composition formula (1) R 1 a SiO (4-a)/2 (1) (in general formula (1), R 1 represents a hydrogen atom or a monovalent hydrocarbon group, a Organopolysiloxane with a kinematic viscosity of 10-100,000 mm 2 /s at 25°C; component (B) is silver nanoparticles with an average particle size of 3-600 nm; Component (C) is a thermally conductive filling material other than component (B), its average particle size is 0.7-100 μm, and has a thermal conductivity of 10W/m°C or more; component (D) is selected from platinum group catalysts, organic peroxides. Oxides and catalysts in catalysts for condensation reactions. |