| abstract |
A solid-state imaging device, its manufacturing method, and electronic equipment. The solid-state imaging device includes an insulating structure formed of an insulating substance penetrating at least the silicon layer on the light receiving surface side, the insulating structure has a forward tapered shape, wherein the top diameter of the upper part of the light receiving surface side of the silicon layer is larger than the silicon layer The bottom diameter of the bottom of the layer. Furthermore, there are provided a method of manufacturing a solid-state imaging device and an electronic device including the solid-state imaging device. |